with - Beckhoff Maximizes Packaging Performance with Minimum Materials Usage at Interpack 2014
Beckhoff Automation is presenting its open automation solutions for the packaging industry at Interpack, the world’s leading trade show for the packaging industry and all related process technologies, which is taking place from May 8 to 14, 2014 in Düsseldorf, Germany. PC-based control and drive technology is ideally suited to the control and monitoring of the entire process of individual packaging machines and complete packaging lines. At the same time PC-based control meets all the requirements for high quality, flexible and, most important of all, resource-saving packaging production.
PC Control and integrated process communication WITH
are the basis for extremely fast control and regulation technology. By leveraging these technologies, extremely precise process cycles can be achieved, so that the packaging can be manufactured with less raw materials and the specified quantities of goods to be packed can be adhered to with greater accuracy. This results in considerable cost savings while minimizing the use of valuable raw materials and energy. All this can be seen at this year’s Interpack in the 200 square meter Beckhoff Solution Forum, which